Agenda
政策公示
On the world international brand gl
The first phase of the evaluation o
Notice on Initiating Wibeis World I
Become the conditions of the branch
The main work of the branch office
Industry associations participate i
Annex I: World International Brand
Annex II: World International Brand
World Famous
The First World Top 2022-02-28
LV 2022-02-28
Top 50 Brands in Asi 2022-02-28
Top 50 European bran 2022-02-28
Hon Hai Precision 2022-02-25
Top 10 Jewelry Brand 2022-02-25
Loewe 2022-02-25
GUCCI 2022-02-25
Top 10 watch brands 2022-02-25
Conference Papers
Think about the deve 2017-05-18
Analysis on the Cons 2017-05-02
On the International 2017-04-17
An Analysis of the D 2017-04-13
In the enterprise su 2017-04-03
Analysis of time tre 2017-03-28
A Study on the Trade 2017-03-16
Contrast and Researc 2017-03-01
An Analysis of the I 2017-02-16
Recommended Enterprises
Verizon Communicatio 2020-06-25
GAZPROM 2020-06-24
Jardine matheson gro 2017-06-28
Hon hai precision in 2017-05-25
Peugeot 2017-05-08
China Ordnance Indus 2017-05-02
Berkshire Hathaway 2017-04-13
Sinopec 2017-04-11
Anheuser-Busch InBev 2017-04-10
Display Dynamic
The real gap between SMIC AND TSMC: A picture to understand
发布时间2020-07-07 23:20:02

The original title: The Second Quarter Global Wafer share: TSMC accounted for more than half, SMIC fifth this year, Wafer, lithography and other advanced semiconductor topics from time to time heated debate. The latest statistics from the Japanese media show that in the second quarter of this year, the number of global wafer fabs was 51.5% , with TSMC holding the No. 1 contract factory. Samsung was second with 18.8% . 3 ~ 5 are grid core, UMC and SMIC respectively. We can see that the gap between SMIC and TSMC is still relatively obvious, for the nominal process level of the gap, at the moment, but also frankly accept. TSMC and Samsung are the only two companies to have mass produced 7nm and are producing 5nm, with apple's A14 bionic processor being built at TSMC's Tainan Plant, which opened in 2018, it is expected to be the world's first mass produced 5nm mobile phone processor, with up to 15bn transistors integrated inside, 76% more than A13's 8.5 bn. If nothing else, TSMC's 3nm launch in 2022 could be the FINFET's curtain call. It is reported that 7nm per square millimeter can hold 96.5 million transistors, 5nm expansion to 170 million, 300 million 3nm will reach the scale. Oh, Shit

 
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